Skip to main content Kyocera the Americas THE NEW VALUE FRONTIER
Global      U.S.A.      Printed Circuit Board Cutting Tools
Home      About      Products      Services      Contact     
About
Culture & Benefits
News
Career Opportunities
Drills
Routers
End Mills
Scoring Tools
Countersinks
Product Bulletins
Product Selection by Application
Feeds & Speeds
Diameter Chart

About > News > Press Release

Email: PCB Customer Service

Customer Service: 1-888-848-9266 (M-F 8-5 All U.S. Time Zones)

About: News

EIPC 2009 Winter Conference Amsterdam

Hello and Happy New Year!

Are you being challenged to reduce costs in the drill room while still needing to maintain quality? Kyocera Tycom has resolved this issue by combining engineering techniques with new technologies...please join us to learn more!

You are invited to attend the Kyocera Tycom presentation on February 12th at the EIPC Winter Meeting. The details are as follows:

WHO: Kyocera Tycom Corporation, Presenter: Randy O'Donnell, Senior Applications Engineer

WHAT: "Challenging The Economics of a Modern Drill Room"
Around the world, PCB fabricators are being challenged to drive cost out of their processes while increasing the reliability of their product.

With the introduction of stringent environmental and consequent material requirements, drill room costs have suffered drastic increases. This cost change demands that conventional methods and perceptions be challenged. The way to better level the Cost Playing Field is to combine engineering techniques with new technologies to drive drilling costs down; this will allow Europe's PCB Manufacturers to better compete with Asia as well as North America.

This paper demonstrates the engineering techniques used to customize drill bit resharpening settings for a manufacturer's products and processes in order to challenge and reduce New Tool Only requirements. This will allow the Modern Drill Room to compete with every operation around the world. Engineering studies considering multiple factors (drill bit diameter, bit design, cutting parameters, entry material, back-up material, laminate materials, copper content, resharpening "stock" removal, and pointing specifications) are required to truly maintain product reliability while driving costs down. This technique is valid for ALL diameters in the PCB spectrum, but especially important on diameters ranging from 0.20mm to 0.50mm, where the majority of holes, and therefore costs, reside.

WHERE: Holiday Inn Hotel. Amsterdam, The Netherlands
WHEN: February 12, 2009 @ 13:30 Session

For more information, see the links below:
http://eipc.org/

http://eipc.org/2009.pdf

There will be a "Question and Answer" panel discussion immediately following the presentation. We look forward to seeing you at the conference, you won't want to miss it!

Sincerely,

The Team at Kyocera Tycom Corporation
 

 
About > News > Press Release Page Top
Contact     Terms of use     Privacy     Sitemap      Copyright KYOCERA International, Inc., all rights reserved.